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New product launch | TTY dual-channel AMD Genoa/Turin standard EEB flagship motherboard T3ADE
Release Time: 2025-12-05 Browsing: 14

New on ! The EEB flagship motherboard based on AMD SP5 standard - T3ADE is about to go into mass production. As a strategic product for the next-generation data centers and workstations, it is equipped with dual AMD Genoa/Turin architecture processors, and the E-ATX board type offers extreme expansion capabilities, providing fundamental support for high-performance computing, AI training, and industrial digital twin scenarios.


Application scenarios


Full coverage from the laboratory to the full industrial chain


1.Scientific computing and physical simulation


Meet the demanding requirements of high floating-point computing performance and large-scale data caching in complex physical simulation scenarios


2. Training and Inference of AI Large Models ▸ Dual-path CPU + Multi-GPU Collaborative Architecture, Utilizing Millions of Concurrent Computing Capabilities


▸PCIe 5.0 x16 high-speed channel, eliminating the bottleneck of GPU data throughput


▸Low-latency memory access optimization, accelerating training of models with billions of parameters


3. Industrial Digital Twin and Real-time Rendering ▸ Achieve real-time synchronization of multiple data sources and high-precision visualization of industrial models with core performance


Define extended limit support for AMD EPYC 9004/9005 series processors


▸Compatible with the Genoa/Turin dual-architecture, the maximum TDP of single CPU can reach up to 500W.


The PCIe has strong expansion capabilities.


▸The PCIe has strong expansion capabilities.


Full protocol storage interface support


▸High-speed storage: 2×PCIe 5.0 M.2 + 2×MCIO (Gen5 x8)


▸ Expansion storage: 2×SFF-8643 (SAS3/SATA) + 2×SATA 3.0


Enhanced Post-Placement I/O


Standardly equipped with 4×USB 3.0 interfaces, meeting the requirements for peripheral expansion and data management.

technical specifications

function                configuration


Plate cut:E-ATX,12"×13.2"(304.8mm x 335.2mm)


CPU: Supports 2 AMD EPYC 9004/9005 series processors, with maximum TDP of 400W for Genoa and 500W for Turin.


Memory: Supports 16 DDR5 memory slots, 1DPC, Genoa 4800MHz/Turin 6400MHz


      Supports RDIMM and 3DS RDIMM, with the maximum support for 4TB of memory.


PCIe expansion: Supports 5 standard PCIe expansion slots (5 * PCIe 5.0 x16)


Local storage: 10 SATA 3.0 (2 SFF-8643 + 2 7-pin SATA) PCIe expansion: Supports 5 standard PCIe expansion slots (5 * PCIe 5.0 x16)

                2个MCIO(PCIe 5.0x8),可支持4个NVMe

2 MCIOs (PCIe 5.0x8), capable of supporting 4 NVMe devices

                2个M.2 接口, PCIe 5.0 x4, 2280&22110

           2 M.2 interfaces, PCIe 5.0 x4, 2280 & 22110


Network: Built-in 2 1Gb RJ45 data network ports, supporting NCSI


Management Function: Integrates the BMC management chip AST2600, supporting functions such as IPMI2.0, KVM, and virtual media.

           

            Provide 1 1Gbps RJ45 dedicated management port


Operating temperature range: 5°C - 35°C


Storage temperature: -40°C to 65°C

Operating relative humidity: 8% to 90% (no condensation)


Storage relative humidity: 5% to 95% (no condensation)


Overall system plan


Flexibly adapt to key scenarios



Form         Core configuration advantages


Server:Supports AMD 9004/9005 series of CPUs, with the maximum TDP reaching up to 500W.


Air-cooling workstation: 1-2 double-width GPUs + IB/network card. Compact HPC solution supports AMD 9004/9005 full series of CPUs, with the maximum TDP reaching 500W.


Liquid-cooling workstation: Supports 4× single-width GPUs + IB/network cards in a single unit


The breakthrough advantage of the liquid cooling solution: Even when all four single-width GPUs are fully loaded, it can still support the expansion of high-performance network cards, resolving the bottleneck of single-node expansion in AI training clusters. Liquid-cooled workstation: Supports 4× single-width GPUs + IB/network cards in a single unit



T3ADE is not only a motherboard,but also TTY profound reflection on the future trends of computing. Whether it is in scientific research breakthroughs, intelligent manufacturing, or AI exploration, it can break through bottlenecks with outstanding performance and help users seize the initiative.

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